Owner of data set Tiangong LCI Data Working Group |
Technical purpose The multi-crystalline silicon (multi-Si) wafer slicing process using multi wire saw is intended for the production of solar-grade wafers for use in photovoltaic (PV) systems. These wafers are the foundation for creating multi-Si ingots, cells, and modules that are essential components in the assembly of PV panels designed to convert sunlight into electrical energy. This technology is predominantly utilized for the manufacture of multi-Si PV modules within the Chinese PV industry, contributing to its sustainable development. |